AlTiN-Cu涂層的組織結(jié)構(gòu)和性能

AlTiN-Cu涂層的組織結(jié)構(gòu)和性能Microstructure and properties of AlTiN-Cu coating

采用陰極弧離子鍍法在硬質(zhì)合金基體上分別沉積AlTiN與AlTiN-Cu涂層，利用XRD、SEM、EDS、XPS、納米壓痕與切削實驗等對比研究AlTiN涂層和AlTiN-Cu涂層的顯微組織與切削性能。結(jié)果表明：AlTiN涂層為典型柱狀晶粒結(jié)構(gòu)，Cu的引入改變AlTiN涂層的晶粒生長方式與擇優(yōu)取向，細化晶粒組織，降低涂層硬度。對比AlTiN與AlTiN-Cu涂層可轉(zhuǎn)位硬質(zhì)合金刀片的切削性能發(fā)現(xiàn)，由于金屬銅的潤滑作用，AlTiN-Cu涂層在干式切削時切削壽命提高44%；Cu的引入導致涂層硬度降低，AlTiN涂層在濕式切削時性能更佳。

AlTiN and AlTiN-Cu coatings were deposited on cemented carbide substrates with cathodic arc ion plating. The properties of coatings were studied by X-ray diffractometry (XRD), scanning electron microscopy(SEM), energy dispersive X-ray spectroscopy(EDX), X-ray photoelectron spectroscopy(XPS), nanoindentation and cutting tests. The results show that AlTiN coating is typical columnar structure, Cu changes the grain growth way and preferred orientation, refines the grain sizes of the coating and reduces the coating hardness. AlTiN layer and AlTiN-Cu layer applied on the indexable inserts were compared in cutting tests. The AlTiN-Cu coatings cutting life is improved by 44% under conditions of dry cutting, which is caused by the effect of the lubrication of copper. Whereas, the AlTiN coatings are more successful at wet cutting, it can be attributed to the addition of Cu decreases the hardness of the coatings.

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